Cooling the limits of power electronics: An integrated approach for e-mobility and AI hardware with copper MIM
As power density continues to rise in applications ranging from e-mobility to AI hardware, thermal management is increasingly defining the performance limits of power electronics. Conventional cooling concepts are struggling to keep pace, making system-level optimisation essential. This article presents a coordinated approach to substrate design, high-current interconnection and advanced copper cooling enabled by Metal Injection Moulding, developed jointly by Schweizer Electronic AG, Schunk Sonosystems GmbH and Schunk Sintermetalltechnik GmbH, and authored by Marvin Luceri, Thorsten Klein and Tim Hanika. ... Read more »







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