PIM INTERNATIONAL MAGAZINE

FOR METAL INJECTION MOLDING, CERAMIC INJECTION MOLDING, & SINTER-BASED ADDITIVE MANUFACTURING

• Registration opens for MILAM 2027 Additive Manufacturing Summit

  June 4, 2026

• Gevorkyan highlights expansion in Polish defence sector

  June 3, 2026

• Euro PM2026 deadline approaches for PM Forum presentations

  June 3, 2026

• Early-bird registration opens for ICAM 2026

  June 3, 2026

• Seco/Warwick celebrates 35 years in heat treatment technology

  June 3, 2026

• CNPC Powder announces California production and R&D facility

  June 2, 2026

THIS QUARTER’S MOST-READ NEWS

IIT Madras plans partial sale of INDO-MIM stake in IPO

Companies & MarketsNews

March 9, 2026

Concurrent Technologies licenses MIM ammunition tech to Ultra Defense Corp

ApplicationsCompanies & MarketsNews

February 9, 2026

McLaren Golf tees off with precision MIM irons

ApplicationsCompanies & MarketsNews

May 1, 2026

INDO-MIM expands precision machining capacity

Companies & MarketsEquipmentNews

May 18, 2026

Asahi Kasei develops POM-based all-in-one binder for PIM

MaterialsNews

April 20, 2026

Ceratizit highlights recycling-based tungsten supply chain

Companies & MarketsMaterialsNews

April 8, 2026

COVER FEATURE:

Industrialising titanium: MTIG’s strategy for scalable, cost-competitive precision MIM and AM

Located at the heart of South Korea’s advanced manufacturing ecosystem, MTIG represents a new model for titanium industrialisation that goes far beyond conventional MIM-Ti parts production. By vertically integrating proprietary Hydride-Dehydride (HDH) powder production, Metal Injection Moulding, and Additive Manufacturing, MTIG delivers cost-competitive, high-precision titanium at scale.

In this article, Professor Dr Jai-Sung Lee interviews MTIG’s founder and CEO, Dr Ji-Hwan Park, to explore the technologies, vision, and full-cycle innovation that set MTIG apart within the global MIM industry.

MOST-READ ARCHIVE ARTICLES

A microstructural investigation of 420 martensitic stainless steel processed by Metal Injection Molding

ArticleMaterialsMetal Injection MoldingProcessing

December 15, 2021

INDO­-MIM in North America: Scaling MIM and developing Binder Jetting to meet evolving market needs

ArticleApplicationsCompany ProfilesMetal Injection MoldingSinter-based AM

July 18, 2025

The maths in the magic: Calculating the sintering shrinkage of MIM parts

ArticleApplicationsMaterialsMetal Injection MoldingProcessing

June 7, 2022

Saturation in metal Binder Jetting: Simple in principle, complicated in practice?

ArticleMaterialsProcessingSinter-based Additive Manufacturing

June 7, 2022

Sintex: Exploring the full flexibility of metal powder-based processes for corrosion-resistant applications

ArticleApplicationsCompany ProfilesMaterialsMetal Injection MoldingSintex

December 15, 2022

Advances in water-debindable feedstock for Ceramic Injection Moulding: Thicker parts, faster cycles

ArticleCeramic Injection MoldingCompany ProfilesProcessing

September 26, 2025

Cooling the limits of power electronics: An integrated approach for e-mobility and AI hardware with copper MIM

As power density continues to rise in applications ranging from e-mobility to AI hardware, thermal management is increasingly defining the performance limits of power electronics. Conventional cooling concepts are struggling to keep pace, making system-level optimisation essential.

This article presents a coordinated approach to substrate design, high-current interconnection and advanced copper cooling enabled by Metal Injection Moulding, developed jointly by Schweizer Electronic AG, Schunk Sonosystems GmbH and Schunk Sintermetalltechnik GmbH, and authored by Marvin Luceri, Thorsten Klein and Tim Hanika.