KIT develops binder system for multi-material Additive Manufacturing

MaterialsNewsResearch
April 20, 2026
CeraMMAM enables the production of high-performance components from various materials in a single build (Courtesy KIT)
CeraMMAM enables the production of high-performance components from various materials in a single build (Courtesy KIT)

Researchers at the wbk Institute of Production Science at Karlsruhe Institute of Technology (KIT), Germany, have developed a material system under the Ceramic Multi-Material Additive Manufacturing (CeraMMAM) project that enables the production of multi-material components. The technology allows the combination of various ceramic materials, as well as the creation of ceramic-metal composites, in a single Additive Manufacturing build using a universal binder system.

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The process is based on Vat Photopolymerisation, in which components are built layer by layer from a light-sensitive feedstock containing ceramic or metal particles. The material is selectively exposed to light, initiating polymerisation and localised solidification.

The binder system enables stable bonding between different materials within a single build, simplifying production. Following manufacture, the binder (comprising liquid polymers, functional additives and a photoinitiator system) is removed.

“With our universal binder, we can produce multi-material components that combine differing material properties,” explained Chantal-Liv Lehmann, wbk Institute of Production Engineering. “This enables new design approaches and functional concepts. For example, ceramic gears can be produced with a flexible core and a hard outer surface.”

The process is also said to enable the accurate reproduction of complex geometries, which may have particular relevance for ceramic applications.

The team has also announced plans to further develop the technology to enable combinations of ceramic and metallic materials. According to KIT, combining electrically insulating ceramics with conductive metal structures may enable applications in power electronics, high-frequency technologies (including 5G and 6G), and miniaturised sensors for connected and autonomous systems.

The team will present industrial prototypes and demonstrators, alongside potential applications, at Hannover Messe (April 20–24, 2026) at the KIT booth (Hall 11, Booth B06).

www.wbk.kit.edu

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MaterialsNewsResearch
April 20, 2026

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