CopperMIM in next generation liquid cool systems

September 27, 2007

The successful application of copperMIM in thermal management systems could be the catalyst that fuels liquid cooling systems production, states Singapore-based PIM producer Acelent Technologies.

The company, established at the end of 2005, reports success with its copperMIM components because they can be sintered to above 95% theoretical density giving a microstructure very similar to that of commercial electrical grade copper C11000.

Acelent states that copperMIM can achieve above 300W/mK (measured value) when using high-grade powder copper, and compared with shaping bar stock MIM offers greater complexity of component features such as slots, thin and long fins. Thicknesses as low as 0.5 mm can be injection moulded.

The MIM process is now competitive with copper machining bar stock due to the sharp increase in raw material price of copper in recent years and the substantial savings that can be achieved by eliminating or reducing machining waste through MIM.

The company states that in the case of metal casings or housing used in electronic packing, milling waste can be as high as 40-50%. The MIM process can also be more easily scaled up as and when required.

The company reports that among its recent successes in liquid cooling systems is a coldplate designed by its customer and produced by MIM to provide improved performance for over-clocking of the CPU for game accelerators.

This flanged copperMIM part contains 279 fin-pins on a thin base and is moulded as one piece so that there is no loss of thermal conductivity through the joints.

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