Chinese MIM networking forum to take place in December

November 7, 2018

A high-level Metal Injection Moulding networking forum and exhibition will take place in Dongguan City, Guangdong Province, China, from December 20-21, 2018. The event is attracting leading MIM producers and their customers from throughout China, alongside local government officials and delegates from related industries.

Since 2013, the Metal Injection Moulding industry has expanded significantly in China, largely due to the surge in demand for consumer electronics or 3C products such as smartphones and laptops, notably Apple’s iPhone and Macbook ranges. Relevant manufacturers from these and other key MIM markets have been invited to give a talk on the outlook for 2019 during the conference.

During the conference Dr Qiu (Yang Hung, Chiou) will hold a panel discussion with a number of MIM experts on the future of the technology and the market, based on nearly ten years of practical experience promoting MIM and Ceramic Injection Moulding technology in China. In order to promote communication and learning throughout the MIM community, the conference organisers have made participation in the forum free to MIM manufacturing company employees and customers.

In addition, PM China has published a list of more than three-hundred MIM-related enterprises including factories, materials producers (powder, feedstock and binders), and equipment manufacturers, available to access on the event website. The organisers stated that they hope the publication of this list, potentially representing more than half of the world’s MIM manufacturers, will enhance opportunities for collaboration between companies while also serving to highlight China’s contribution to the global MIM industry.

The event is organised by New Alliance (Shanghai) Exhibition Services Co., Ltd., the China Steel Structure Association Powder Metallurgy Branch, and the Guangdong Powder Metallurgy Industry Technology Innovation Alliance. For more information contact [email protected].

In the latest issue of PIM International…

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