AMT showcases tungsten-copper heat sinks for high-temperature electronics

AMT Pte Ltd, headquartered in Singapore, recently showcased tungsten copper (WCu) heat sinks and highlighted the advantages of Metal Injection Molding (MIM) in the manufacturing process.

Unlike traditional methods, MIM allows manufacturers such as AMT to create intricate WCu heat sink designs that fit perfectly into compact electronics. It allows for the production of complex shapes while offering tight tolerances and minimal post-processing.

MIM also scales easily from prototyping to full-scale manufacturing, enables uniform material distribution for consistent thermal performance, and customises material ratios and shapes to meet unique thermal demands.

Advantages of tungsten copper

AMT explains that the WCu heat sinks utilise tungsten’s thermal stability and copper’s heat dissipation properties, making it suitable for applications that require reliability in high-temperature environments. WCu heat sinks are available in different compositions, such as W70Cu30 or W80Cu20, with each composition tailored to leverage the metals’ respective properties for specific thermal and mechanical performance criteria.

WCu composites are typically produced through copper infiltration or Powder Metallurgy. These processes aim to ensure high material density and excellent bonding, making WCu heat sinks suitable for use in compact, high-heat environments.

AMT highlighted the following key advantages:

• High thermal conductivity: copper allows WCu components to effectively transfer heat away from sensitive components
• Extreme heat resistance: Tungsten can withstand temperatures above 3000°C, making the composite well-suited to harsh environments
• Low coefficient of thermal expansion (CTE): WCu’s low CTE makes it compatible with ceramics and other materials in microelectronic devices
• High density for effective heat spreading: WCu is ideal for compact electronics that demand maximum thermal dispersion in minimal space
• Well-suited for MIM processing and environmental stability: WCu offers better processability via Metal Injection Molding than pure tungsten and delivers reliable performance in vacuum or corrosive conditions

Typical applications include semiconductor and sensor devices, medical imaging equipment and scientific industrial systems. In semiconductor and sensor devices, WCu heat sinks prevent overheating in power electronics and ultrasonic sensor systems. In medical imaging equipment, such as CT scanners and X-ray tubes, the rapid heat dissipation is critical for image clarity and patient safety. Instruments requiring thermal stability, such as hydraulics and laser metrology systems, are also typical applications.

The full post is available here.

amt-mat.com