PIM International, Vol. 1 No. 1 March 2007
Print copies of this issue are however still available to purchase for £35.00 including free shipping worldwide.
To order a print copy please email [email protected].
Powder injection moulding in the medical and dental sectors
Powder injection moulding has become an established processing route for a wide range of medical and dental applications. Bernard Williams looks at some notable success stories for PIM in this lucrative sector.
Metal injection moulding in Asia: current status and future prospects
Dr Yoshiyuki Kato takes a close look at the development and prospects for the world’s largest MIM producing region.
Developments in the powder injection moulding of titanium at EuroPM2006
Dr David Whittaker reports on the MIM Titanium Workshop held at EURO PM2006, Ghent.
Powders, binders and feedstocks for powder injection moulding
Professor Randall German reviews the development of feedstock for powder injection moulding and considers what the future holds in terms of new materials and applications.
New application for MIM of tungsten: Divertor Modules for ITER
R. Zauner, A. Altenburger and R. Nagel
The international community decided recently that the ITER nuclear fusion test reactor will be built in Cadarache, France. In the toroid plasma ring energy densities of up to 20 MWm-2 are predicted.
CAE-based process design of PIM for microfluidic device components
Roshan Urval, Carl Wu, Sundar V. Atre, Seong-Jin Park and Randall M. German
Design issues related to PIM for fabrication of thin-walled, high-aspect ratio geometries were investigated in this study. These types of geometries are typical to the field of microtechnology-based energy and chemical systems (MECS).
Thermal performance of MIM thermal-management device
Velda Josef and Lye-King Tan
As processors are getting faster and hotter, heat dissipation becomes an important thermal issue to be considered. In recent years, there are many new developments in thermal management devices in order to overcome the thermal barrier. The design started from common thermal management device of passive heat sinks with mounted fan to heat pipe and now the solvent transportation.
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