A copper and diamond composite ‘Super Heat Sink’ produced by micro metal injection moulding (µMIM) was promoted by a Japanese consortium at CeBIT, the world’s foremost tradeshow for the digital industry in Hannover earlier this year.

Developed and manufactured by Taisei- Kogyo Co. Ltd. in Osaka, Japan, in collaboration with Osaka Prefectural College, the device is aimed at supercomputer applications, along with other demanding electronic devices such as the Peltier.

The heat sink is made of a copper diamond composite with a micro-structured surface to further improve thermal conductivity.

This technology, combining advanced materials with metal injection moulding processing, offers thermal conductivity of 580 W/mK, 1.4 times that of copper. Each heat sink pillar is 1500 µm high and 500 µm wide. “We can change the coefficient of thermal expansion (CTE) freely by adjusting the proportions of copper and diamond.”, stated Dr Kazuaki Nishiyabu, formerly of Osaka Prefectural College.

Prof. Nishiyabu recently took up a new position as Associate Professor in the Department of Mechanical Engineering at Kinki University, Osaka. His work on various aspects of MIM and µMIM in conjunction with Taisei-Kogyo Co. Ltd. is expected to continue.

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