Arburg GmbH & Co KG, Lossburg, Germany, has announced that it will present more information on its Metal Injection Moulding solution for smartphones at Euro PM2017. The company will present its solution during Session 34 of the programme; ‘PIM II – Advanced Processes’, in a presentation given by Marko Maetzig, responsible for Arburg’s PIM process development.
Maetzig will address the low-cost Metal Injection Moulding of larger thin-walled parts for smartphone applications in a presentation co-authored by Hartmut Walcher, also from the Arburg PIM team, and Martin Blömacher and Sven Fleischmann from BASF SE, Germany.
Arburg first presented its injection moulded smartphone housings in 2016, following their joint development with BASF. Catamold 17-4 PH Plus feedstock was processed to produce a green compact with a thickness of around only 1 mm and a length of 136 mm. In order to maintain consistent green density over the entire component, Arburg’s mould was dynamically temperature controlled using a hot runner with liquid temperature control, producing high-quality surface finishes which were subsequently polished to a high gloss.
“This extends the application range of metal injection moulding, which up to now was more likely to be used to manufacture small and complex parts – an area in which Arburg is active and already enjoys an established reputation in various industrial sectors”, stated Maetzig.
Euro PM2017 will take place in Milan, Italy, October 1-4, and is one of the Powder Metallurgy industry’s most important annual events. Organised by the EPMA, the event will showcase the latest developments from the global PM supply chain.