Arburg, Lossburg, Germany, hosted its second international PIM conference at its Arburg Customer Care Center on June 5–6, 2018. The event, titled ‘The Future of Powder Injection Moulding (PIM)’, attracted two-hundred global PIM industry delegates and eighteen high-profile speakers.
Aimed at presenting an outlook on the future of PIM for the production of complex metal and ceramic components, the event featured an extensive agenda including presentations, live application demonstrations and panel discussions.
Stephan Doehler, Sales Director Europe, who has headed the Arburg PIM team for around twenty years, stated after the conference, “Being a pioneer in the field of PIM with fifty-five years of experience and the market leader for the process, we succeeded in making this second PIM conference again an excellent platform for constructive and intense expert exchange. We’re delighted to be passing on our skills and knowledge to other PIM experts and beginners in the field.”
“Just like at the first event in 2013, the speakers and guests from all over the world all loved our PIM conference,” added Hartmut Walcher, who has been with Arburg’s PIM team for almost three decades. “Everyone who was there agrees that there’s hardly any other event that offers such comprehensive insights into global PIM activities and the latest on materials, machines, mould and process technology.”
In the intervals between presentations, several Allrounder injection moulding machines in the Arburg Customer Center were used to produce turbine wheels from the superalloy PolyMIM Inconel In 718, bionically optimised MIM heat sinks for LED lights from Catamold 316L, thin-walled MIM rear casings for smartphones from Catamold 316L Plus and CIM insulators for micro-format model trains from INMAPOM K3030. The programme concluded with a factory tour offering insights into machine production and assembly at Arburg.
A full report from Arburg’s 2nd International PIM Conference will be published in the September 2018 issue of PIM International (Vol. 12 No. 3).